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XCKU3P-L1FFVD900I

Part No XCKU3P-L1FFVD900I
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 304 I/O 900FCBGA / Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 304 31641600 355950 900-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD
Series Kintex® UltraScale+™
Package Tray
Product Status Active
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 304
Voltage - Supply 0.698V ~ 0.876V
Mounting Type Surface Mount
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Base Product Number XCKU3
MSL Level 4 (72 Hours)
ECCN 5A002A1
HTSUS 8542.39.0001
Win Source Part Number 1353767-XCKU3P-L1FFVD900I
Ultra Librarian 3D Model Ultra Librarian XCKU3P-L1FFVD900I CAD Model

Description

The XCKU3P-L1FFVD900I is a powerful FPGA from the Kintex UltraScale+ series by AMD.

  • Manufacturer: AMD
  • Series: Kintex UltraScale+
  • Operating Temperature: -40°C to 100°C
  • Voltage Supply: 0.698V to 0.876V
  • Logic Elements/Cells: 355,950
  • RAM Bits: 31,641,600
  • Number of I/O: 304
  • Mounting Type: Surface Mount
  • Package: 900-BBGA, FCBGA
  • Product Status: Active

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