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XCKU3P-2SFVB784I

Part No XCKU3P-2SFVB784I
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 304 I/O 784FCBGA / series Field Programmable Gate Array (FPGA) IC 304 31641600 355950 784-BFBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Kintex® UltraScale+™
Package Bulk
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 304
Voltage - Supply 0.825V ~ 0.876V
Mounting SMD (SMT)
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 784-BFBGA, FCBGA
Supplier Device Package 784-FCBGA (23x23)
Base Product Number XCKU3
MSL Level 4 (72 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1019339-XCKU3P-2SFVB784I
Ultra Librarian 3D Model Ultra Librarian XCKU3P-2SFVB784I CAD Model

Description

The XCZU6EG-2FFVB1156I is an embedded system-on-chip (SoC) that belongs to the Zynq UltraScale+ MPSoC EG series. It is manufactured by Xilinx.

  • Series: Zynq UltraScale+ MPSoC EG
  • Core: quad ARM Cortex-A53 MPCore with CoreSight, dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2
  • Speed: 533MHz, 600MHz, and 1.3GHz
  • Packaging: tray
  • I/O: 328
  • RAM: 256KB
  • Logic Cells: 469K+
  • Architecture: MCU and FPGA
  • Temperature Range: -40°C to 100°C (TJ)
  • Package/Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
  • Alternative parts: XCZU6EG-2FFVB1156IXCZU6EG2FFVB1156I
  • MSL Level: 4 (72 hours)
  • REACH Status: REACH unaffected
  • HTSUS: 8542.39.0001
  • Base Product Number: XCZU6

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $494.2080 $494.2080
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Availability: 400 pieces
Order Increment : 1 pcs
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