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Same model may have multiple batches, images only for reference.
XCKU3P-1FFVB676I Real Image
Same model may have multiple batches, images only for reference.

XCKU3P-1FFVB676I

Part No XCKU3P-1FFVB676I
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 280 I/O 676FCBGA / series Field Programmable Gate Array (FPGA) IC 280 31641600 355950 676-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Kintex® UltraScale+™
Package Tray
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 280
Voltage - Supply 0.825V ~ 0.876V
Mounting SMD (SMT)
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Base Product Number XCKU3
MSL Level 4 (72 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1003194-XCKU3P-1FFVB676I
Ultra Librarian 3D Model Ultra Librarian XCKU3P-1FFVB676I CAD Model

Description

The XCKU3P-1FFVB676I is an integrated circuit that belongs to the Embedded - FPGAs (Field Programmable Gate Array) category, part of the Kintex® UltraScale+™ series manufactured by AMD Xilinx.

  • Package: Tray
  • Mounting Type: SMD (SMT)
  • I/O: 280
  • LABs/CLBs: 20340
  • Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Voltage Supply: 0.825V to 0.876V
  • Package/Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
  • Operating Temperature: -40°C to 100°C (TJ)
  • MSL: 4 (72 hours)
  • HTSUS: 8542.39.0001
  • Base Product Number: XCKU3

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