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Same model may have multiple batches, images only for reference.
XCKU11P-3FFVD900E Real Image
Same model may have multiple batches, images only for reference.

XCKU11P-3FFVD900E

Part No XCKU11P-3FFVD900E
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 408 I/O 900FCBGA / series Field Programmable Gate Array (FPGA) IC 408 53964800 653100 900-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Kintex® UltraScale+™
Package Tray
Number of LABs/CLBs 37320
Number of Logic Elements/Cells 653100
Total RAM Bits 53964800
Number of I/O 408
Voltage - Supply 0.873V ~ 0.927V
Mounting SMD (SMT)
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Base Product Number XCKU11
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1010823-XCKU11P-3FFVD900E
Ultra Librarian 3D Model Ultra Librarian XCKU11P-3FFVD900E CAD Model

Description

The XCKU11P-3FFVD900E is a Kintex® UltraScale+™ FPGA IC from AMD Xilinx.

  • Series: Kintex® UltraScale+™
  • Category: Embedded - FPGAs (Field Programmable Gate Array)
  • Package Type: Tray
  • Standard Package: 1
  • Mounting Type: SMD (SMT)
  • I/Os: 408
  • LABs/CLBs: 37320
  • Logic Elements/Cells: 653100
  • RAM Bits: 53964800
  • Voltage Supply: 0.873V to 0.927V
  • Package/Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
  • Operating Temperature: 0°C to 100°C (TJ)
  • HTSUS: 8542.39.0001

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