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Same model may have multiple batches, images only for reference.
XC7Z045-1FBG676I Xilinx Inc.
Same model may have multiple batches, images only for reference.

XC7Z045-1FBG676I

Part No XC7Z045-1FBG676I
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 676FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq®-7000
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z045
Standard Package 1 pcs
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Win Source Part Number 843852-XC7Z045-1FBG676I
Ultra Librarian 3D Model Ultra Librarian XC7Z045-1FBG676I CAD Model

Description

The 843852-XC7Z045-1FBG676I is an integrated circuit (IC) belonging to the Zynq-7000 series of embedded system-on-chip (SoC) devices from AMD.

  • Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight technology
  • Operating Speed: 667MHz
  • Package Type: Tray
  • Standard Package Quantity: 1 piece
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART
  • Peripherals: DMA
  • I/O Pins: 130
  • RAM Size: 256KB
  • Flash Size: Not specified
  • Architecture: MCU and FPGA
  • Package/Case: 676-BBGA, FCBGA
  • Operating Temperature Range: -40°C to 100°C
  • Product Status: Active

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