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Same model may have multiple batches, images only for reference.
XCZU4EG-3FBVB900E
Same model may have multiple batches, images only for reference.

XCZU4EG-3FBVB900E

Part No XCZU4EG-3FBVB900E
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 900FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 600MHz, 1.5GHz 900-FCBGA (31x31)
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Category Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Manufacturer AMD Xilinx
Packaging Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.5GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Case / Package 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU4
RoHS Status ROHS3 Compliant
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1318100-XCZU4EG-3FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU4EG-3FBVB900E CAD Model

Description

The AMD Xilinx XCZU4EG-3FBVB900E is an embedded system on chip (SoC) from the Zynq®UltraScale+™ FPGA series.

  • Manufacturer: AMD Xilinx
  • Win Source Part Number: 1318100
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM®Cortex™-R5 with CoreSight™
  • Speed: 600MHz, 1.5GHz
  • I/O: 204
  • RAM Size: 256KB
  • Interface: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA, WDT
  • Package: 900-FCBGA (31x31)
  • Temperature Range: 0°C to 100°C (TJ)
  • Supply: Limited
  • ROHS3 Compliance: Compliant

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