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XCZU15EG-L1FFVB1156I

Part No XCZU15EG-L1FFVB1156I
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 1156FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Xilinx Inc.
Packaging Tray
Architecture MCU, FPGA
Core Processor Quad ARM Cortex -A53 MPCore with CoreSight , Dual ARM Cortex -R5 with CoreSight , ARM Mali -400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq UltraScale+ FPGA, 747K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C
Manufacturer Package 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328
Manufacturer Pack Quantity 1
MSL Level 4 (72 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 812859-XCZU15EG-L1FFVB1156I
Ultra Librarian 3D Model Ultra Librarian XCZU15EG-L1FFVB1156I CAD Model

Description

The XCZU15EG-L1FFVB1156I is a low-popularity Zynq UltraScale+ FPGA manufactured by Xilinx Inc.

  • Package: 1156-FCBGA (35x35)
  • Temperature Range: -40°C to 100°C
  • Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2
  • Speed: 500MHz, 600MHz, 1.2GHz
  • I/Os: 328
  • RAM Size: 256KB
  • Flash Size: No Flash
  • Architecture: MCU and FPGA
  • Category: Integrated Circuits (ICs)
  • Supplier Device Package: 1156-FCBGA (35x35)
  • Manufacturer Package: 1156-BBGA, FCBGA
  • Manufacturer Pack Quantity: 1
  • MSL Level: 4 (72 Hours)

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $357.9851 $357.9851
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Availability: 1,000 pieces
Order Increment : 1 pcs
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