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XCVU13P-1FHGB2104I

Part No XCVU13P-1FHGB2104I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 702 I/O 2104FCBGA
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 702 514867200 3780000 2104-BBGA, FCBGA
Manufacturer Xilinx Inc.
Series Virtex® UltraScale+™
Package Tray
Number of I/O 702
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 2104-BBGA, FCBGA
Case / Package 2104-FCBGA (52.5x52.5)
Family Name XCVU13
MSL Level 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Quantity per package 1
Popularity High
Supply and Demand Status Balance
Win Source Part Number 903980-XCVU13P-1FHGB2104I
Ultra Librarian 3D Model Ultra Librarian XCVU13P-1FHGB2104I CAD Model

Description

The XCVU13P-1FHGB2104I is a Virtex UltraScale+ FPGA from Xilinx, designed for high-performance and high-density applications. It's part of the Virtex UltraScale+ family, which offers significant improvements in performance and power efficiency compared to previous generations. This FPGA is suitable for demanding applications requiring advanced features and high-speed connectivity.

Applications

  • Data center acceleration
  • High-performance computing (HPC)
  • Networking and telecommunications infrastructure
  • Aerospace and defense systems
  • Advanced driver-assistance systems (ADAS)
  • Medical imaging

Features

  • Logic Cells: Approximately 3.8 million
  • Registers: Over 1 million
  • LUTs (Look-Up Tables): Over 1.9 million
  • Block RAM: Over 75 Mb
  • UltraRAM: Over 36 Mb
  • DSP Slices: Thousands of DSP48E2 slices
  • Transceivers: High-speed serial transceivers supporting various protocols (e.g., PCIe Gen4, Ethernet)
  • Memory Interfaces: Supports DDR4, DDR5, and other high-bandwidth memory technologies
  • Package: 2104-pin FCBGA (Flip Chip Ball Grid Array)
  • Speed Grade: -1 (indicating the speed performance)
  • Temperature Grade: I (Industrial Temperature Range: -40°C to +100°C Tj)

Benefits

  • High Performance: Delivers exceptional performance for demanding workloads.
  • High Density: Offers a large amount of logic resources, enabling complex designs.
  • Advanced Connectivity: Provides high-speed serial transceivers for various communication standards.
  • Power Efficiency: Optimizations in the UltraScale+ architecture result in improved power efficiency.
  • Scalability: Can be used in a wide range of applications, from data center to embedded systems.
  • Security Features: Includes security features for protecting sensitive data and designs.
  • Industrial Temperature Range: Suitable for operation in harsh environments.

Additional Details

The XCVU13P-1FHGB2104I utilizes advanced process technology and architectural innovations to achieve its high performance and power efficiency. The device is supported by Xilinx's Vivado Design Suite, which provides a comprehensive set of tools for design, implementation, and verification. The Vivado tools include features for high-level synthesis, place-and-route, and power analysis. This FPGA is designed for applications that require a combination of high performance, high density, and advanced connectivity. It is commonly used in data centers for workload acceleration, as well as in aerospace and defense systems where reliability and performance are critical. The industrial temperature range ensures reliable operation in demanding environments.

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1+ $2,134.3284 $2,134.3284
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