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Same model may have multiple batches, images only for reference.
XC7K325T-3FBG676E Real Image
Same model may have multiple batches, images only for reference.

XC7K325T-3FBG676E

Part No XC7K325T-3FBG676E
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 400 I/O 676FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 400 16404480 326080 676-BBGA, FCBGA
Manufacturer Xilinx Inc.
Series Kintex®-7
Package Tray
Number of I/O 400
Operating Temperature Range 0°C ~ 100°C (TJ)
Mounting Surface Mount
Package 676-BBGA, FCBGA
Case / Package 676-FCBGA (27x27)
Family Name XC7K325
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 1
Popularity High
Supply and Demand Status Balance
Win Source Part Number 939633-XC7K325T-3FBG676E
Ultra Librarian 3D Model Ultra Librarian XC7K325T-3FBG676E CAD Model

Description

The XC7K325T-3FBG676E is a Kintex-7 series Field Programmable Gate Array (FPGA) IC manufactured by Xilinx Inc.

  • Package: 676-BBGA, FCBGA
  • Mounting: Surface
  • I/O: 400
  • Operating Temperature Range: 0°C to 100°C
  • Popularity: High
  • Supply and Demand Status: Balanced
  • Production Lead Time: 51 weeks
  • REACH: Unaffected
  • ECCN: 3A991D

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1+ $194.7762 $194.7762
2+ $174.6269 $349.2538
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