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XC6VLX130T-L1FFG1156C

Part No XC6VLX130T-L1FFG1156C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 600 I/O 1156FCBGA
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 600 9732096 128000 1156-BBGA, FCBGA
Manufacturer Xilinx Inc.
Series Virtex®-6 LXT
Package Tray
Number of I/O 600
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 1156-BBGA, FCBGA
Case / Package 1156-FCBGA (35x35)
Family Name XC6VLX130
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 24
Popularity High
Supply and Demand Status Balance
Win Source Part Number 939598-XC6VLX130T-L1FFG1156C
Ultra Librarian 3D Model Ultra Librarian XC6VLX130T-L1FFG1156C CAD Model

Description

The XC6VLX130T-L1FFG1156C is a Virtex-6 LXT FPGA from Xilinx. It is designed for high-performance logic applications requiring a blend of high-speed serial connectivity, advanced memory interfacing, and flexible logic resources. This FPGA is part of the Virtex-6 family, known for its power efficiency, high performance, and comprehensive feature set.

Applications

  • High-performance computing
  • Data center acceleration
  • Networking and telecommunications infrastructure
  • Wireless communication systems
  • Aerospace and defense applications
  • Industrial automation and control

Features

  • Logic Resources: Contains a large amount of configurable logic blocks (CLBs), including slice registers, look-up tables (LUTs), and distributed RAM.
  • Block RAM: Integrated block RAM resources for on-chip data storage.
  • DSP Slices: Dedicated DSP slices for high-performance digital signal processing applications.
  • High-Speed Serial I/O: Supports various high-speed serial protocols, including PCIe, Serial RapidIO, and Ethernet.
  • Memory Interface: Supports a wide range of external memory interfaces, including DDR2, DDR3, and QDRII+.
  • Power Management: Advanced power management features for low power consumption.
  • Packaging: Offered in a 1156-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package.

Benefits

  • High Performance: Provides exceptional performance for demanding applications.
  • Flexibility: Configurable logic resources allow for implementation of custom hardware accelerators.
  • Integration: Integrated block RAM and DSP slices reduce the need for external components.
  • Connectivity: High-speed serial I/O and memory interfaces enable seamless integration with other system components.
  • Low Power: Advanced power management features minimize power consumption.

Technical Specifications

The XC6VLX130T-L1FFG1156C contains approximately 128,000 logic cells. It supports a maximum user I/O count based on package. It contains multiple block RAM tiles, with a total block RAM capacity. The number of DSP48E1 slices is optimized for signal processing. The operating junction temperature range is -40°C to +100°C. The supply voltage ranges and power consumption levels are dependent on the specific application and configuration.

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