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Same model may have multiple batches, images only for reference.
XC3SD3400A-4CS484C Real Image
Same model may have multiple batches, images only for reference.

XC3SD3400A-4CS484C

Part No XC3SD3400A-4CS484C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 309 I/O 484CSBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 309 2322432 53712 484-FBGA, CSPBGA
Manufacturer Xilinx Inc.
Series Spartan®-3A DSP
Package Tray
Number of I/O 309
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 484-FBGA, CSPBGA
Case / Package 484-CSPBGA (19x19)
Family Name XC3SD3400
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 84
Popularity High
Supply and Demand Status Balance
Win Source Part Number 939305-XC3SD3400A-4CS484C
Ultra Librarian 3D Model Ultra Librarian XC3SD3400A-4CS484C CAD Model

Description

The Xilinx Inc. Spartan-3A DSP series Field Programmable Gate Array (FPGA) IC is designed for various applications.

  • I/Os: 309
  • Package: 484-FBGA, CSPBGA
  • Operating Temperature: 0°C to 85°C (TJ)
  • Family: XC3SD3400
  • Part Number: XC3SD3400A-4CS484C
  • ECCN: 3A991D
  • Supplied: tray package
  • Quantity per Package: 84
  • Estimated Production Lead Time: 51 weeks
  • REACH: REACH unaffected

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