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XC2VP7-6FFG672C

Part No XC2VP7-6FFG672C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 396 I/O 672FCBGA
Datasheet
Sample
Rohs State Need to verify
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Categories Integrated Circuits (ICs)
Features series Field Programmable Gate Array (FPGA) IC 396 811008 11088 672-BBGA, FCBGA
Manufacturer Xilinx Inc.
Series Virtex®-II Pro
Package Tray
Part Status Obsolete
Number of I/O 396
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 672-BBGA, FCBGA
Case / Package 672-FCBGA (27x27)
Family Name XC2VP7
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 40
Popularity High
Supply and Demand Status Balance
Win Source Part Number 939282-XC2VP7-6FFG672C
Ultra Librarian 3D Model Ultra Librarian XC2VP7-6FFG672C CAD Model

Description

The XC2VP7-6FFG672C is a Virtex-II Pro series FPGA from Xilinx, integrating both FPGA fabric and PowerPC processor cores for embedded systems applications. The 'FFG672' signifies a Flip-Chip Fine-Pitch Ball Grid Array package with 672 pins, offering extensive I/O capabilities. The 'C' denotes that this is a commercial temperature grade device.

Applications:

  • Embedded Control Systems: Implemented in industrial automation, motor control, and robotics for real-time processing and control.
  • Communication Systems: Utilized in wireless base stations, networking equipment, and satellite communication systems for signal processing and data transmission.
  • Image Processing: Employed in video surveillance, medical imaging, and machine vision applications for real-time image analysis and enhancement.
  • Instrumentation: Integrated into test and measurement equipment, data acquisition systems, and scientific instruments for high-speed data processing and control.
  • Aerospace and Defense: Used in radar systems, guidance systems, and electronic warfare applications for high-performance processing and control.

Features:

  • Integrated PowerPC Processors: Provides embedded PowerPC processor cores for real-time processing and control.
  • High Logic Density: Offers a large number of configurable logic blocks (CLBs) for implementing custom digital circuits.
  • Embedded Memory: Includes on-chip block RAM and distributed RAM for high-speed data storage and retrieval.
  • High-Speed Serial Interfaces: Integrates RocketIO multi-gigabit transceivers for high-bandwidth serial communication.
  • Flexible I/O Connectivity: Supports a wide range of I/O standards and protocols, enabling seamless connection to external devices.

Benefits:

  • System Integration: Combines processor and FPGA functionality on a single chip, reducing board space and system cost.
  • High Performance: Delivers high-speed processing and flexible logic implementation for demanding applications.
  • Rapid Prototyping: Enables fast prototyping and development of embedded systems.
  • Power Efficiency: Provides power optimization features to minimize energy usage.
  • Design Flexibility: Allows for customization and adaptation to specific application requirements.

Additional Details:

The XC2VP7-6FFG672C has 74,880 logic cells and contains one embedded PowerPC core. It has 793,920 system gates. The distributed RAM capacity is 389,888 bits. It provides 476 available I/O pins. The core voltage for the FPGA fabric is 1.5V, and the processor core voltage is 1.8V. The speed grade is -6, indicating a faster performance level.

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1+ $388.0598 $388.0598
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