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Same model may have multiple batches, images only for reference.
XC2S200-6FGG256C Real Image
Same model may have multiple batches, images only for reference.

XC2S200-6FGG256C

Part No XC2S200-6FGG256C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 176 I/O 256FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 176 57344 5292 256-BGA
Manufacturer Xilinx Inc.
Series Spartan®-II
Package Tray
Number of I/O 176
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 256-BGA
Case / Package 256-FBGA (17x17)
Family Name XC2S200
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Quantity per package 90
Popularity High
Supply and Demand Status Balance
Win Source Part Number 939224-XC2S200-6FGG256C
Ultra Librarian 3D Model Ultra Librarian XC2S200-6FGG256C CAD Model

Description

The Xilinx Spartan-II XC2S200-6FGG256C is a series field programmable gate array (FPGA) IC that comes in a 256-BGA package.

  • I/Os: 176
  • Family: XC2S200
  • ECCN: EAR99
  • Supply and Demand Status: Balanced
  • Package: Tray
  • Pieces per Package: 90
  • MSL Level: 3 (168 hours)
  • REACH: Unaffected
  • Estimated Production Lead Time: 51 weeks

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