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XC2S150-6FGG456C

Part No XC2S150-6FGG456C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 260 I/O 456FBGA
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 260 49152 3888 456-BBGA
Manufacturer Xilinx Inc.
Series Spartan®-II
Package Tray
Number of I/O 260
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 456-BBGA
Case / Package 456-FBGA (23x23)
Family Name XC2S150
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Part Number 122-1798, XC2S1506FGG456C
Quantity per package 60
Popularity High
Supply and Demand Status Balance
Win Source Part Number 939223-XC2S150-6FGG456C
Ultra Librarian 3D Model Ultra Librarian XC2S150-6FGG456C CAD Model

Description

The XC2S150-6FGG456C is a Spartan-II series Field Programmable Gate Array (FPGA) from Xilinx. It is designed for a wide range of digital logic applications, offering flexibility and programmability for custom hardware implementations.

Applications:

  • Digital signal processing (DSP)
  • Image processing
  • Embedded systems
  • Communication systems
  • Industrial control systems
  • Aerospace and defense applications

Features:

  • 150,000 system gates
  • Flexible logic resources
  • High-performance architecture
  • On-chip RAM
  • Clock management circuitry
  • Advanced I/O capabilities
  • 456-pin Fine-Pitch Ball Grid Array (FBGA) package

Benefits:

  • Reconfigurable hardware for rapid prototyping
  • Customizable logic implementation for application-specific needs
  • High-speed performance for demanding applications
  • Integrated memory for data storage and processing
  • Flexible clocking options for optimized system performance
  • Versatile I/O interfaces for connecting to external devices

Additional Details:

The XC2S150-6FGG456C FPGA provides a programmable platform for implementing complex digital circuits. It features a large number of configurable logic blocks (CLBs) and programmable interconnect resources, allowing designers to create custom hardware solutions tailored to their specific requirements. The on-chip RAM provides memory resources for data storage and processing. The FPGA also includes clock management circuitry for generating and distributing clock signals throughout the device. The advanced I/O capabilities enable the FPGA to interface with a wide range of external devices. The 456-pin FBGA package provides a high-density interconnect solution. The device is commonly used in applications requiring high-speed data processing and flexible hardware configurations. Designers use hardware description languages (HDLs) such as VHDL or Verilog to describe the desired logic functions, and then use Xilinx's design tools to synthesize, implement, and program the FPGA. The device operates over a specific voltage range and temperature range as specified in the Xilinx datasheet. It’s a popular choice for applications that need to be quickly prototyped and adapted in the field.

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