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W25Q01JVSFIM

Part No W25Q01JVSFIM
Manufacturer Winbond Electronics
Catalog IT infrastructure Memory
Description 1Gb Serial SpiFlash (Dual Die) Dual/Quad
Sample
Rohs State rohs
ECAD Module
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Category IT infrastructure Memory
Win Source Part Number 1452743-W25Q01JVSFIM
Manufacturer Winbond Electronics
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 1Gbit
Memory Organization 128M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 133MHz
Write Cycle Time - Word, Page 3.5ms
Access Time 7.5ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC
Ultra Librarian 3D Model Ultra Librarian W25Q01JVSFIM CAD Model

Description

The W25Q01JVSFIM by Winbond is a high-capacity 1Gb Serial SpiFlash memory chip designed for performance-critical applications. This Dual/Quad SPI memory offers a 'Dual Die' feature, essentially integrating two chips in one package for double the storage without increasing the footprint. Ideal for applications requiring large code storage or data logging, such as high-definition multimedia interfaces, advanced graphics, and IoT devices, this SpiFlash supports high-speed data transfers in both dual and quad SPI modes. The advanced features include erase and program suspend, allowing operations to be paused for other tasks. With a focus on reliability and efficiency, the W25Q01JVSFIM provides flexible and secure data storage options, including lockable sectors and high endurance, making it a top choice for next-generation electronic designs.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $52.3881 $52.3881
3+ $42.9851 $128.9553
4+ $41.6418 $166.5672
5+ $40.2986 $201.4930
7+ $38.9553 $272.6871
9+ $34.9254 $314.3286
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 11,111 pieces
Order Increment : 1 pcs
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