The TLP719(TP is a high-speed photocoupler from Toshiba Semiconductor and Storage. It is designed to provide electrical isolation between circuits while enabling data transfer. This photocoupler features high common-mode transient immunity and is suitable for various applications requiring robust isolation.

Applications

• Programmable Logic Controllers (PLCs)
• Inverter control circuits
• AC servo drives
• Factory automation equipment
• Digital interfaces for microprocessors
• Measurement equipment

Features

• High isolation voltage: 3750 Vrms (minimum)
• High common-mode transient immunity: ±10 kV/µs (minimum)
• High-speed data transmission: 10 Mbps (typical)
• Operating temperature range: -40°C to +100°C
• Package: 5-pin SO6
• RoHS compliant

Benefits

• Provides electrical isolation to protect sensitive circuits from high voltages and transients.
• High common-mode transient immunity prevents false triggering due to noise.
• High-speed data transmission enables fast communication between isolated circuits.
• Wide operating temperature range ensures reliable performance in harsh environments.
• Compact SO6 package saves board space.

Additional Details

The TLP719(TP consists of an infrared light-emitting diode (LED) and a photodetector integrated into a single package. When current flows through the LED, it emits light that is detected by the photodetector, turning it on. This process provides electrical isolation between the input and output circuits. The device is designed to meet stringent safety standards and is commonly used in industrial automation and power control systems.

Key electrical characteristics include a forward voltage of approximately 1.2V for the LED, and a collector-emitter voltage rating of 20V for the phototransistor. The propagation delay is typically in the nanosecond range, allowing for high-speed data transmission. The high common-mode transient immunity of ±10 kV/µs ensures that the device remains unaffected by high-voltage transients, preventing spurious signals from being transmitted across the isolation barrier.