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THGAM0G3D1DBAI5

Part No THGAM0G3D1DBAI5
Manufacturer Toshiba Semiconductor and Storage
Catalog Unclassified Memory
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Category Integrated Circuits(ICs)
Family Memory
Manufacturer Toshiba Semiconductor and Storage
Win Source Part Number 216978-THGAM0G3D1DBAI5
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian THGAM0G3D1DBAI5 CAD Model

Description

The THGAM0G3D1DBAI5 is an embedded MultiMediaCard (eMMC) from Toshiba Semiconductor and Storage. eMMC is a type of flash memory designed for use in mobile devices and other embedded systems. It integrates NAND flash memory and a controller into a single package, simplifying the design and manufacturing process for device makers.

Applications

  • Smartphones: Used as the primary storage for the operating system, applications, and user data.
  • Tablets: Similar to smartphones, providing storage for the operating system and user content.
  • Embedded Systems: Utilized in various embedded applications requiring non-volatile storage, such as industrial control systems and automotive infotainment.
  • IoT Devices: Employed in Internet of Things (IoT) devices for storing firmware, configuration data, and collected sensor data.

Features

  • eMMC Standard: Compliant with the industry-standard eMMC specification, ensuring compatibility and interoperability.
  • NAND Flash Memory: Based on NAND flash technology, offering high storage density and non-volatile data retention.
  • Integrated Controller: Includes a built-in controller that manages memory operations, error correction, and wear leveling.
  • High-Speed Interface: Supports high-speed data transfer rates, enabling fast boot times and application loading.
  • Small Form Factor: Compact package design, suitable for space-constrained mobile and embedded applications.

Benefits

  • Simplified Design: The integrated eMMC solution simplifies the design process by combining NAND flash and a controller into a single component.
  • Reduced BOM Cost: Lower overall system cost due to the reduced number of components required.
  • Improved Performance: High-speed data transfer rates result in faster boot times and application loading.
  • Enhanced Reliability: The built-in controller manages error correction and wear leveling, extending the lifespan of the flash memory.
  • Wide Compatibility: Compliant with the eMMC standard, ensuring compatibility with a wide range of host processors and operating systems.

Additional Details

The THGAM0G3D1DBAI5 eMMC device typically operates over a wide temperature range and is designed for long-term reliability. Its power consumption is optimized for mobile applications, contributing to improved battery life. Specific capacity will vary depending on the exact part number variation. This specific part is designed for embedded applications requiring reliable, high-performance storage in a small form factor.

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