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TC74LCXZ240FK

Part No TC74LCXZ240FK
Manufacturer Toshiba Semiconductor and Storage
Catalog Misc Products
Sample
Rohs State rohs
ECAD Module
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Manufacturer Toshiba Semiconductor and Storage
Popularity Medium
Supply and Demand Status Balance
Win Source Part Number 839692-TC74LCXZ240FK
Ultra Librarian 3D Model Ultra Librarian TC74LCXZ240FK CAD Model

Description

The TC74LCXZ240FK is an octal buffer/line driver with 3-state outputs, designed for high-speed, low-voltage operation. It is part of Toshiba's LCXZ family, known for its extremely low noise and high-speed performance. This device is suitable for driving high-capacitance loads and is often used in bus-oriented applications. The integrated noise reduction circuitry minimizes ground bounce, ensuring signal integrity in demanding applications.

Applications

  • Bus interface
  • Line driving
  • Data buffering
  • Memory addressing
  • Clock distribution

Features

  • Low-voltage operation: 1.65 V to 3.6 V
  • High-speed operation: tpd = 3.0 ns (typical) at VCC = 3.3 V
  • 3-state outputs for bus isolation
  • Low noise: reduced ground bounce
  • Integrated noise reduction circuitry
  • Output impedance control

Benefits

  • Improved system performance due to high-speed operation
  • Reduced noise, ensuring signal integrity
  • Versatile interface with 3-state outputs
  • Simplified system design with integrated noise reduction
  • Reliable operation over a wide voltage range

Additional Details

The TC74LCXZ240FK features eight independent buffers/line drivers. The direction of data flow is unidirectional. The output enable (OE) input controls the 3-state outputs. When OE is low, the outputs are enabled; when OE is high, the outputs are in the high-impedance state, allowing for bus isolation and memory interface applications. The device's inputs are tolerant to 5.5 V, allowing interface with 5 V logic circuits even when operating at lower supply voltages. The operating temperature range is -40°C to +85°C, making it suitable for a wide range of environments. The device incorporates an advanced noise reduction circuit that minimizes ground bounce and improves overall signal quality. The device is available in VSSOP package. The device supports a wide operating temperature, and it is RoHS compliant. The reduced ground bounce is especially important in applications with multiple devices sharing the same ground plane.

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