The SN74HCT273APW is a high-performance, octal D-type flip-flop with clear, designed and manufactured by Texas Instruments. This integrated circuit is part of the 'HCT' family, which means it is a high-speed CMOS device that is TTL-compatible. It is specifically created to offer the functionality of the 74HCT273 logic family with the added benefit of high-speed operation similar to equivalent bipolar Schottky TTL.

Key Features

• Logic Type: Octal D-Type Flip-Flop with clear
• Package: The device comes in a TSSOP (Thin Shrink Small Outline Package) with 20 pins, providing a compact footprint for space-constrained applications.
• Operating Voltage: It operates at a standard 5V, which makes it compatible with many other standard logic devices.
• Output Current: Capable of providing a high drive current of ±6mA at the output, allowing for direct driving of many peripheral elements without the need for additional buffer components.

Performance Characteristics

The SN74HCT273APW is designed to have a robust performance in a wide range of applications. It has a typical clock-to-output delay time of 13 ns, which ensures fast response in critical timing applications. The device also features a low power consumption, with a typical ICC of only 4µA when in the quiescent state, making it suitable for power-sensitive designs.

Applications

This flip-flop is versatile and can be used in a variety of digital applications, including:

• Temporary storage of data
• Data synchronization and transfer
• System initialization through the synchronous clear function
• Implementation in registers, counters, and memory devices

Quality and Reliability

Texas Instruments is known for its commitment to quality, and the SN74HCT273APW is no exception. It is designed to meet or exceed the stringent requirements of the industrial and commercial markets. The device is fully specified for -40°C to 85°C operational range, ensuring reliability across a wide temperature spectrum.

Ordering and Packaging

The SN74HCT273APW is available for order in various packaging options, including tape and reel for automated assembly processes. Detailed packaging and ordering information can be found in the product datasheet or by contacting Texas Instruments directly.