The TW-50-08-T-D-700-075 is a terminal strip from Samtec's TW series, designed for board-to-board connections. It is a reliable and versatile solution for various electronic interconnect applications, offering a high-density connection and robust performance.

Applications

• Board-to-Board Connections
• Datacom/Telecom Equipment
• Medical Devices
• Industrial Automation
• Test and Measurement Equipment

Features

• Number of Positions: 50
• Number of Rows: 2
• Pitch: 0.8 mm
• Termination: Through-hole
• Body Material: High Temperature Thermoplastic
• Contact Material: Phosphor Bronze
• Plating: Gold
• Stack Height: 7.00 mm

Benefits

• Provides a high-density connection for space-constrained applications.
• Ensures reliable electrical performance with gold-plated contacts.
• Offers a robust mechanical connection with a high-temperature thermoplastic body.
• Suitable for reflow soldering processes due to its high-temperature resistance.
• Facilitates efficient board-to-board stacking with a defined stack height.

The TW-50-08-T-D-700-075 terminal strip features a fine pitch of 0.8 mm, enabling a high density of connections in a small footprint. The dual-row design further maximizes the number of signals that can be routed through the connector. The gold plating on the contacts provides excellent conductivity and resistance to corrosion, ensuring a reliable electrical connection over time. The high-temperature thermoplastic body allows the connector to withstand the high temperatures of reflow soldering processes. The 7.00 mm stack height is precisely controlled to facilitate consistent board-to-board spacing in stacked configurations. This connector is widely used in applications where space is a premium and reliable signal transmission is critical. Samtec's TW series is known for its durability and performance, making it a preferred choice for demanding electronic applications.