The SSQ-130-02-T-D-RA is a Tiger Beam™ socket strip manufactured by Samtec. This connector is a high-density solution designed for board-to-board applications where space is constrained. The part number indicates a double row, 30-position socket strip with a 0.635mm pitch, tin plating, and a right-angle orientation (RA).

Applications

• High-Density Board-to-Board Connections: Used when a large number of signals need to be routed between PCBs in a compact space.
• Right-Angle Connections: Provides a perpendicular connection between boards, saving space and allowing for different board orientations.
• Industrial Control Systems: Employed in control equipment where reliable connections are crucial and space is limited.
• Medical Devices: Used in medical equipment where data integrity and a compact design are critical.
• Telecommunications Equipment: Found in telecom systems where high-density and space-saving connections are necessary.

Features

• 0.635mm Pitch: Offers a high-density interconnect solution, maximizing board space utilization.
• Double Row: Provides a greater number of contacts in a smaller footprint compared to single-row connectors.
• 30 Positions: Accommodates a specific number of signal connections based on the application requirements.
• Tiger Beam™ Contacts: Samtec's Tiger Beam™ contact system ensures a reliable and secure connection with high withdrawal forces.
• Tin Plating: Provides a cost-effective and solderable contact finish.
• Right-Angle Orientation (RA): Allows for perpendicular board-to-board connections.

Benefits

• Space Optimization: The fine pitch and right-angle orientation maximize board space utilization, enabling more compact designs.
• Reliable Connection: The Tiger Beam™ contact system ensures a stable and secure connection, minimizing signal loss.
• Cost-Effective: Tin plating provides a reliable connection at a lower cost compared to gold plating.
• Flexible Design: Right-angle orientation allows for greater flexibility in board layout and system design.
• Simplified Assembly: Designed for easy and efficient surface mount soldering onto the PCB.

Additional Details

The SSQ-130-02-T-D-RA typically features a black insulator material. The contact material is usually a beryllium copper alloy with tin plating. It is designed for reflow soldering processes. The right-angle configuration requires careful consideration of PCB layout and mating connector orientation. Current rating, voltage rating, and operating temperature ranges depend on the specific application and should be verified in the datasheet.