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SSQ-130-01-T-D-LL

Part No SSQ-130-01-T-D-LL
Manufacturer Samtec Inc.
Catalog Rectangular Connectors
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category Connectors, Interconnects>Rectangular Connectors - Headers, Receptacles, Female Sockets
Mfr Samtec Inc.
Series SSQ
Package Bulk
Connector Type Receptacle
Contact Type Forked
Style Board to Board or Cable
Number of Positions 60
Number of Positions Loaded All
Pitch - Mating 0.100" (2.54mm)
Number of Rows 2
Row Spacing - Mating 0.100" (2.54mm)
Mounting Type Through Hole
Termination Press-Fit, Solder
Fastening Type Push-Pull
Contact Finish - Mating Tin
Insulation Color Black
Insulation Height 0.335" (8.51mm)
Contact Length - Post 0.104" (2.64mm)
Temperature Range - Operating -55°C ~ 105°C
Material Flammability Rating UL94 V-0
Contact Finish - Post Tin
Voltage Rating 465VAC, 655VDC
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Contact Material Phosphor Bronze
Base Product Number SSQ-130
Standard Package 1
MSL Level Not Applicable
ECCN EAR99
HTSUS 8536.69.4040
Win Source Part Number 1291071-SSQ-130-01-T-D-LL
Ultra Librarian 3D Model Ultra Librarian SSQ-130-01-T-D-LL CAD Model

Description

The SSQ-130-01-T-D-LL is a Tiger Beam™ socket strip manufactured by Samtec. It's a high-density interconnect designed for board-to-board connections requiring reliability and secure mating. This particular part features a single row of 30 positions, a 0.635mm pitch, tin plating on the contacts, double the standard contact force, and a locking lead (LL) for enhanced security.

Applications

  • High-Density Board-to-Board Connections: Used when a large number of signals need to be routed between PCBs in a compact space.
  • Industrial Control Systems: Employed in control equipment where reliable connections are crucial, and vibration resistance is needed.
  • Medical Devices: Used in medical equipment where data integrity and secure connections are critical.
  • Aerospace and Defense: Deployed in military and aerospace applications requiring robust and reliable interconnects that can withstand harsh environments.
  • Telecommunications Equipment: Found in telecom systems where high-density and secure connections are necessary.

Features

  • 0.635mm Pitch: Provides a high-density interconnect, maximizing board space utilization.
  • Single Row: Offers a simple and efficient connection for routing signals on a PCB.
  • 30 Positions: Accommodates a specific number of signal connections based on the application.
  • Tiger Beam™ Contacts: Ensures a reliable and robust connection with high withdrawal forces.
  • Tin Plating: Provides a cost-effective and solderable contact finish.
  • Double Contact Force: Increases the contact pressure for a more secure and reliable connection, especially in demanding environments.
  • Locking Leads (LL): Provides additional security against accidental disconnection due to vibration or shock.

Benefits

  • Space Saving: The fine pitch allows for high-density connections in a small area.
  • Reliable Connection: Tiger Beam™ contacts and double contact force ensure a stable and dependable signal transmission.
  • Secure Mating: Locking leads prevent accidental disconnections, enhancing the overall reliability of the system.
  • Cost-Effective: Tin plating offers a more affordable solution compared to gold plating while maintaining good performance.
  • Easy Integration: The single-row design simplifies PCB layout and assembly.

Additional Details

The SSQ-130-01-T-D-LL typically features a black insulator material. The contact material is generally beryllium copper alloy with tin plating. The locking feature requires a compatible mating connector to engage properly. Current rating, voltage rating, and operating temperature range will depend on the specific application and should be verified with the product datasheet.

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