The SSQ-128-03-T-D is a Tiger Beam™ socket strip manufactured by Samtec. It is a high-density interconnect designed for board-to-board applications where a large number of signals need to be reliably transmitted. The part number specifies a 28-position, double-row socket strip with a 0.635mm pitch and tin plating.

Applications

• High-Density Interconnect: Applications requiring a large number of connections in a compact space, such as in networking equipment and telecommunications systems.
• Board-to-Board Connections: Used for connecting multiple PCBs within a system, enabling modular designs.
• Industrial Automation: Suitable for use in industrial control systems and automation equipment where reliable connections are essential.
• Consumer Electronics: Found in various consumer electronic devices requiring high-density interconnects.
• Data Acquisition Systems: Used in data acquisition systems for connecting sensors, data loggers, and other peripherals.

Features

• 0.635mm Pitch: Offers a high-density interconnect solution, maximizing board space utilization.
• Double Row: Provides a greater number of contacts in a smaller footprint compared to single-row connectors.
• 28 Positions: Accommodates a specific number of signal connections based on the application requirements.
• Tiger Beam™ Contacts: Samtec's Tiger Beam™ contact system ensures a reliable and secure connection with high withdrawal forces.
• Tin Plating: Provides a cost-effective and reliable connection solution.
• Surface Mount Technology (SMT): Designed for easy and efficient surface mount soldering onto the PCB.

Benefits

• Increased Board Density: The fine pitch and double-row design allow for a higher density of connections in a smaller area, optimizing board space.
• Reliable Signal Transmission: The Tiger Beam™ contact system ensures a stable and secure connection, minimizing signal loss and maintaining signal integrity.
• Cost-Effective Solution: Tin plating provides a reliable connection at a lower cost compared to gold plating.
• Simplified Assembly: Surface mount design simplifies the assembly process and reduces manufacturing costs.
• Versatile Applications: Suitable for a wide range of applications requiring high-density interconnects.

Additional Details

The SSQ-128-03-T-D typically features a black insulator material. The contact material is usually a beryllium copper alloy with tin plating. It is designed for reflow soldering processes. Current rating, voltage rating, and operating temperature ranges depend on the specific application and should be verified in the datasheet.