The BSH-030-01-F-D-A-TR is a header from Samtec Inc., part of their BSH series, designed for board-to-board connections. It's a surface mount, dual-row header with a 0.100" (2.54 mm) pitch, commonly used in a wide range of electronic applications for making reliable and space-efficient connections between circuit boards.

Applications:

• Board-to-Board Connections
• Data and Signal Transmission
• Medical Equipment
• Industrial Automation
• Telecommunications Equipment

Features:

• Dual-Row Design: Increases contact density and saves board space.
• Surface Mount Technology (SMT): Enables automated assembly and efficient use of PCB space.
• 0.100" (2.54 mm) Pitch: Industry-standard pitch for compatibility with other components.
• Gold-Plated Contacts: Provides reliable and corrosion-resistant connections.
• Tape and Reel Packaging: Suitable for automated pick-and-place assembly.

Benefits:

• Reliable Connections: Gold-plated contacts ensure stable signal transmission.
• Efficient Assembly: SMT design allows for automated assembly processes.
• Space Saving: Dual-row design maximizes contact density in a small footprint.
• Versatile: Suitable for various applications requiring board-to-board connections.
• Durable: Robust construction ensures long-term reliability.

Technical Specifications:

The BSH-030-01-F-D-A-TR features 30 contacts per row, totaling 60 contacts. The contact material is phosphor bronze with gold plating. It is designed for surface mount soldering. The insulator material is typically high-temperature thermoplastic, suitable for reflow soldering processes. The operating temperature range typically spans from -55°C to +125°C. The specific mating height depends on the mating connector. It is packaged on tape and reel for automated assembly.

The BSH-030-01-F-D-A-TR provides a reliable and efficient solution for board-to-board connections in a wide variety of electronic applications. Its SMT design, gold-plated contacts, and dual-row configuration make it an excellent choice for designers seeking robust and space-saving interconnect solutions.