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K4S561632C-TC75

Part No K4S561632C-TC75
Manufacturer Samsung
Catalog Hard To Find
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Reference Date Code 13+
Reference case TSOP54
Manufacturer Samsung
Manufacturer Homepage www.samsung.com/Products/Semiconductor
Win Source Part Number 710598-K4S561632C-TC75
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian K4S561632C-TC75 CAD Model

Description

The Samsung K4S561632C-TC75 is a 256Mb DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) chip. It is designed for use in a variety of applications requiring high-speed data transfer and storage.

Applications:

  • Graphics cards
  • Set-top boxes
  • Networking equipment
  • Printers
  • Other embedded systems requiring memory.

Features:

  • Double data rate architecture: Transfers data on both rising and falling edges of the clock signal, effectively doubling the data transfer rate.
  • Clock frequency: Operates at a specific clock frequency (e.g., 133MHz), which determines the data transfer rate.
  • Capacity: Offers a storage capacity of 256Mb (Megabits).
  • Supply voltage: Typically operates at 2.5V.
  • Interface: Uses a standard DDR SDRAM interface for communication with the memory controller.
  • Package: Available in a specific package type (e.g., TSOP).

Benefits:

  • High bandwidth: Enables fast data transfer rates, improving system performance.
  • Low latency: Reduces memory access time, resulting in quicker response times.
  • High capacity: Provides ample memory for storing data and instructions.
  • Low power consumption: Operates at a relatively low voltage, reducing power consumption and heat dissipation.
  • Cost-effective: Offers a balance of performance and price, making it suitable for a wide range of applications.

Additional Details:

The K4S561632C-TC75 conforms to JEDEC standards for DDR SDRAM. Its operating temperature ranges can vary, so consulting the datasheet is important for environmental considerations. Specific timing parameters like CAS latency (CL) and RAS-to-CAS delay (tRCD) are crucial for proper memory controller configuration. Refer to the device datasheet for detailed specifications, including timing diagrams, electrical characteristics, and package dimensions.

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