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UPD60802AF1-A11-BND-E2-A

Part No UPD60802AF1-A11-BND-E2-A
Manufacturer Renesas Electronics America
Catalog Embedded - System On Chip (SoC)
Description SOC MEDIA IC
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr Renesas Electronics America
Package Bulk
Product Status Active
Standard Package 2,000 pcs
MSL Level 3 (168 Hours)
REACH Status Vendor Undefined
ECCN EAR99
HTSUS 8542.39.0001
Win Source Part Number 902165-UPD60802AF1-A11-BND-E2-A
Ultra Librarian 3D Model Ultra Librarian UPD60802AF1-A11-BND-E2-A CAD Model

Description

The 902165-UPD60802AF1-A11-BND-E2-A is a system on chip (SoC) integrated circuit designed for embedded applications manufactured by Renesas Electronics America.

  • Package: Bulk
  • Standard Package Quantity: 2000 pcs
  • ECCN: EAR99
  • Product Status: Active

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $109.2422 $109.2422
2+ $105.7183 $211.4366
3+ $102.1944 $306.5832
4+ $91.6227 $366.4908
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 2,270 pieces
Order Increment : 1 pcs
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Shipping Information

Shipped from HK warehouse
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