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QCC3003-0-52MQFN-TR-00-0

Part No QCC3003-0-52MQFN-TR-00-0
Manufacturer Qualcomm
Catalog OEM Parts (O - R)
Description Entry-Level Flash Programmable Audio SoCs Designed for Bluetooth Headsets and Speakers
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Schedule B 8542390000
Win Source Part Number 966296-QCC3003-0-52MQFN-TR-00-0
Categories OEM Parts(O-R)
Manufacturer Qualcomm
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian QCC3003-0-52MQFN-TR-00-0 CAD Model

Description

The QCC3003-0-52MQFN-TR-00-0 is a Bluetooth audio SoC (System on a Chip) from Qualcomm. It's designed for use in wireless audio devices such as headphones, speakers, and headsets. This SoC integrates a Bluetooth radio, audio processing capabilities, and memory, providing a complete solution for wireless audio applications. It supports various audio codecs and Bluetooth profiles, ensuring compatibility with a wide range of devices. The QCC3003 is known for its low power consumption and high-quality audio performance, making it an ideal choice for portable audio products.

Applications

  • Bluetooth headphones
  • Wireless speakers
  • Bluetooth headsets
  • Soundbars
  • Automotive audio systems

Features

  • Bluetooth 5.0 connectivity
  • Qualcomm aptX audio support
  • Low power consumption
  • Integrated audio processing
  • Small package size (MQFN)

Benefits

  • Provides high-quality wireless audio experience
  • Extends battery life in portable devices
  • Simplifies design with integrated functionality
  • Enables compatibility with a wide range of Bluetooth devices
  • Reduces board space requirements

Additional Details

The QCC3003-0-52MQFN-TR-00-0 supports Bluetooth 5.0, offering improved range, speed, and reliability compared to older Bluetooth versions. It includes Qualcomm aptX audio technology, which delivers high-resolution audio over Bluetooth. The integrated audio processing capabilities allow for noise cancellation, echo reduction, and other audio enhancements. The MQFN package provides a compact footprint, making it suitable for space-constrained applications. This SoC is designed to minimize power consumption, extending the battery life of portable audio devices. The QCC3003 is supported by a comprehensive suite of development tools and software, simplifying the design and development process. It is a popular choice among audio equipment manufacturers for its performance, features, and ease of integration. Qualcomm's reputation for quality ensures that this SoC meets industry standards for reliability and performance. It also incorporates support for voice assistants. It is a cost effective solution for wireless audio applications.

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