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Category Integrated Circuits (ICs) - Embedded - Microcontrollers
Mfr NXP
Series LPC55S6x
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M33
Core Size 32-Bit
Speed 150MHz
Connectivity Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O 64
Program Memory Size 640KB (640K x 8)
Program Memory Type FLASH
RAM Size 320K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 10x16b SAR
Oscillator Type Internal
Temperature Range - Operating -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 100-LQFP Exposed Pad
Supplier Device Package 100-HLQFP (14x14)
Standard Package 90 pcs
REACH Status REACH Unaffected
Win Source Part Number 1116957-LPC55S69JBD100E
Ultra Librarian 3D Model Ultra Librarian LPC55S69JBD100E CAD Model

Description

NXP LPC55S69JBD100E Microcontroller Overview

The NXP LPC55S69JBD100E is a high-performance microcontroller unit (MCU) designed for a wide range of industrial, consumer, and IoT applications. This advanced MCU is part of NXP's LPC5500 series, which is known for its exceptional efficiency, security features, and processing capabilities. The LPC55S69JBD100E is built on an Arm® Cortex®-M33 dual-core processor, providing users with a robust platform for developing complex embedded systems.

Key Features:

  • Processor: Dual-core Arm® Cortex®-M33 running at up to 150 MHz, with an optional floating-point unit (FPU) and a dedicated co-processor for enhanced security and cryptographic operations.
  • Memory: Equipped with 640 KB of on-chip flash memory and 320 KB of SRAM, offering ample storage for firmware and application data.
  • Security: Integrated with advanced security features, including a PUF (Physically Unclonable Function) for secure key storage, hardware-accelerated encryption, and a secure boot process to ensure the integrity of the system.
  • Connectivity: A comprehensive set of communication interfaces, such as high-speed USB, CAN FD, and multiple SPI, I2C, and USART interfaces, enabling versatile connections with peripherals and other devices.
  • Package: Housed in a compact BGA100 package, the LPC55S69JBD100E is suitable for space-constrained applications.
  • Power Efficiency: Designed with energy efficiency in mind, featuring multiple power-saving modes to reduce power consumption for battery-powered and low-power applications.
  • Development Support: Supported by NXP's extensive suite of development tools and software, including the MCUXpresso SDK, IDE, and Config Tools, simplifying the development process and reducing time to market.

Applications:

The NXP LPC55S69JBD100E MCU is ideal for a range of applications that require high-performance computing, connectivity, and advanced security. Its versatile feature set makes it suitable for:

  • Industrial control systems
  • Internet of Things (IoT) devices
  • Wearable technology
  • Smart home automation
  • Secure data communication
  • Medical devices
  • And many other embedded system applications

With its powerful dual-core architecture and comprehensive feature set, the LPC55S69JBD100E is engineered to meet the demands of the next generation of smart, connected devices.

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Pricing & Ordering

Quantity Unit Price Ext. Price
8+ $6.8969 $55.1752
18+ $5.6590 $101.8620
28+ $5.4822 $153.5016
38+ $5.3053 $201.6014
49+ $5.1285 $251.2965
66+ $4.5980 $303.4680
!
Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 20,690 pieces
MOQ: 8 pcs
Order Increment : 1 piece
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