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BUK554-200A

Part No BUK554-200A
Manufacturer NXP / Nexperia
Catalog END - OF - LIFE
Description PowerMOS transistor Logic level FET
Sample
Rohs State Need to verify
ECAD Module
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Manufacturer NXP
Win Source Part Number 1156043-BUK554-200A
Manufacturer Homepage www.nxp.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian BUK554-200A CAD Model

Description

The BUK554-200A is a high-performance Power MOSFET designed and manufactured by NXP Semiconductors. This device is tailored for high-speed switching applications, making it a quintessential component for modern electronic circuits. With its robust design and advanced manufacturing techniques, the BUK554-200A offers superior performance in a compact package, ensuring both reliability and efficiency.

Key Features

  • Voltage Capacity: The BUK554-200A is engineered to handle a continuous drain-source voltage of up to 200V, providing a wide safety margin for various applications.
  • Current Capability: This MOSFET can efficiently manage a continuous drain current of 17A, making it suitable for high-power operations.
  • Low On-state Resistance: With an RDS(on) of just 0.115 ohms, the device ensures minimal power loss during operation, leading to enhanced overall efficiency.
  • Fast Switching Speed: The component is designed for rapid switching, reducing transition losses and improving performance in high-frequency circuits.
  • TO-220 Package: Encased in a widely used TO-220 package, the BUK554-200A is easy to integrate into various circuit designs, providing excellent heat dissipation and mechanical durability.

Applications

The BUK554-200A is versatile and can be employed in a broad range of applications. Its high-speed switching capability makes it an ideal choice for:

  • DC-to-AC inverters for solar power systems
  • Switched Mode Power Supplies (SMPS)
  • Motor control circuits in automotive and industrial settings
  • Power management systems
  • LED lighting solutions

Quality and Reliability

NXP Semiconductors is renowned for its commitment to quality, and the BUK554-200A is no exception. It is built to meet the rigorous standards expected of high-performance power components, ensuring long-term reliability even in demanding environments. With its advanced thermal management and robust construction, the BUK554-200A stands as a testament to NXP's dedication to excellence in semiconductor technology.

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