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UPA2351T1G(1)-E4

Part No UPA2351T1G(1)-E4
Manufacturer NEC
Catalog HOT - SALES and EOL Components (U - Z)
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Manufacturer NEC
Win Source Part Number 389332-UPA2351T1G(1)-E4
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian UPA2351T1G(1)-E4 CAD Model

Description

The UPA2351T1G(1)-E4 is a P-channel Power MOSFET manufactured by NEC (now Renesas Electronics). It is designed for high-efficiency power switching applications. This MOSFET is often used in DC-DC converters, load switching, and other power management circuits where low on-resistance and fast switching speeds are critical.

Applications:

  • DC-DC Converters: Used in buck converters for voltage regulation.
  • Load Switching: Efficiently switches power to various loads in electronic systems.
  • Power Management Circuits: Found in battery management and power distribution systems.
  • Motor Control: Suitable for low-power motor drive applications.
  • LED Lighting: Used in LED drivers for brightness control and dimming.

Features:

  • P-Channel MOSFET: Simplifies high-side switching configurations.
  • Low On-State Resistance (RDS(on)): Minimizes power loss during conduction.
  • Fast Switching Speed: Enables efficient operation in high-frequency circuits.
  • Surface Mount Package: Facilitates automated assembly and compact design.
  • RoHS Compliant: Complies with environmental regulations regarding hazardous substances.

Benefits:

  • Improved Efficiency: Low RDS(on) reduces power dissipation.
  • Smaller Size: Surface mount package allows for miniaturization.
  • Simplified Design: P-channel configuration simplifies gate drive circuitry.
  • Enhanced Reliability: Robust design ensures stable performance.
  • Environmentally Friendly: RoHS compliance reduces environmental impact.

Additional Details:

The UPA2351T1G(1)-E4 is characterized by its drain-source voltage (VDS), gate-source voltage (VGS), and continuous drain current (ID). The datasheet provides specific values. Thermal resistance (RθJA or RθJC) is essential for thermal management. Gate charge (Qg) affects switching performance. The surface-mount package requires specific soldering profiles. The device's static and dynamic characteristics are detailed in the datasheet, along with safe operating area (SOA) information, which must be adhered to during operation to ensure long-term reliability.

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