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90147-1312

Part No 90147-1312
Manufacturer Molex, LLC
Catalog Rectangular Connectors
Description 2.54mm (.100) Pitch C-Grid® PC Board Connector, Single Row, Vertical, 12 Circuits
Sample
Rohs State rohs
ECAD Module
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Manufacturer Molex, LLC
Win Source Part Number 1134178-90147-1312
Manufacturer Homepage www.molex.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian 90147-1312 CAD Model

Description

The Molex 90147-1312 is a Micro-Fit 3.0 connector header designed for wire-to-board applications. As part of the Micro-Fit 3.0 series, it offers a compact solution with a 3.0mm pitch, balancing current-carrying capabilities with space efficiency. This header is commonly used in various electronic devices where a reliable and dense connection is required.

Applications

  • Power supplies
  • Industrial equipment
  • Robotics
  • Consumer electronics
  • Automotive electronics

Features

  • Compact Size: 3.0mm pitch allows for high-density connections.
  • Positive Locking: Ensures a secure and reliable connection, preventing accidental unmating.
  • Durable Material: Constructed from high-quality materials for long-term reliability.
  • Polarization Feature: Prevents mismating, ensuring correct connections.
  • Through-Hole Termination: Designed for secure mounting to PCBs.

Benefits

  • Reliable Electrical Performance: Provides consistent and stable connections.
  • Space-Saving Design: Maximizes board space utilization.
  • Easy Installation: Simplifies the assembly process.
  • Reduced Downtime: Minimizes the risk of connection failures.
  • Versatile Usage: Suitable for a wide range of applications and industries.

Additional Details

The 90147-1312 is a through-hole connector header, meaning it's designed to be soldered directly onto a PCB. It's made of high-temperature thermoplastic to withstand reflow soldering processes. This header is meant to be mated with corresponding Micro-Fit 3.0 receptacles. Consult the Molex datasheet for current and voltage ratings, mating compatibility, and detailed specifications.

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