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A2F060M3E-FGG256I

Part No A2F060M3E-FGG256I
Manufacturer Microsemi Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC SOC CORTEX-M3 80MHZ 256FBGA / ARM® Cortex®-M3 System On Chip (SOC) IC series ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 80MHz 256-FPBGA (17x17)
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Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr Microsemi Corporation
Series SmartFusion®
Package Tray
Product Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Speed 80MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)
Number of I/O MCU - 26, FPGA - 66
Base Product Number A2F060M3E
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Names A2F060M3E-FGG256I-ND,150-A2F060M3E-FGG256I
Standard Package 90
Win Source Part Number 1042111-A2F060M3E-FGG256I
Ultra Librarian 3D Model Ultra Librarian A2F060M3E-FGG256I CAD Model

Description

The 1042111-A2F060M3E-FGG256I is an embedded system on chip (SoC) with an ARM Cortex-M3 core processor.

  • Core Processor: ARM Cortex-M3
  • Speed: 80MHz
  • RAM Size: 16KB
  • Flash Size: 128KB
  • Total Gates: 60K gates
  • Temperature Range: -40°C ~ 100°C (TJ)
  • Package: 256-LBGA
  • Manufacturer: Microsemi Corporation
  • Status: Obsolete

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