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Same model may have multiple batches, images only for reference.
EDB8164B4PT-1D-F-D
Same model may have multiple batches, images only for reference.

EDB8164B4PT-1D-F-D

Part No EDB8164B4PT-1D-F-D
Manufacturer Micron Technology Inc.
Catalog SDRAM
Description IC DRAM 8GBIT PARALLEL 216FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 35 Weeks
Features SDRAM - Mobile LPDDR2 Memory IC 8Gb (128M x 64) Parallel 533 MHz 216-FBGA (12x12)
Manufacturer Micron Technology Inc.
Package Bulk
Operating Temperature Range -30°C ~ 85°C (TC)
Mounting Surface Mount
Package 216-WFBGA
Case / Package 216-FBGA (12x12)
Family Name EDB8164
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0036
Quantity per package 1680
Popularity High
Supply and Demand Status Balance
Win Source Part Number 917825-EDB8164B4PT-1D-F-D
Ultra Librarian 3D Model Ultra Librarian EDB8164B4PT-1D-F-D CAD Model

Description

The Micron Technology Inc. EDB8164B4PT-1D-F-D is a high-performance mobile LPDDR2 memory IC with a capacity of 8Gb (128M x 64) Parallel.

  • Temperature Range: -30°C to 85°C
  • Package: 216-WFBGA
  • Application: integrated circuits (ICs)
  • Popularity: popular
  • Supply and Demand Status: balanced
  • Pieces per package: 1680
  • Estimated Production Lead Time: 35 weeks

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