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A3PE1500-FGG676I

Part No A3PE1500-FGG676I
Manufacturer Microchip Technology
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 444 I/O 676FBGA / ProASIC3E Field Programmable Gate Array (FPGA) IC 444 276480 676-BGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Embedded>FPGAs (Field Programmable Gate Array)
Manufacturer Microchip Technology
Packaging Tray
Total RAM Bits 276480
Number of I/O 444
Number of Gates 1500000
Voltage - Supply 1.425V ~ 1.575V
Mounting Surface Mount
Temperature Range - Operating -40°C ~ 100°C (TJ)
Case / Package 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number A3PE1500
RoHS Status RoHS Compliant
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 40
Win Source Part Number 1318019-A3PE1500-FGG676I
Ultra Librarian 3D Model Ultra Librarian A3PE1500-FGG676I CAD Model

Description

Overview of Microchip Technology's A3PE1500-FGG676I

The A3PE1500-FGG676I is a high-performance FPGA (Field Programmable Gate Array) from Microchip Technology, designed to cater to a wide array of applications ranging from industrial control systems to advanced communication devices. This device is part of the ProASIC3 series, known for providing cost-effective, low-power programmable logic solutions.

Key Features

  • High Capacity: The A3PE1500-FGG676I offers a substantial logic capacity, making it suitable for complex digital systems. Its versatile architecture allows for efficient implementation of custom logic designs.
  • Low Power Consumption: Designed with power efficiency in mind, this FPGA is ideal for applications that require a balance between performance and energy consumption, such as battery-operated devices.
  • Security: Security is a priority in the design of the A3PE1500-FGG676I, featuring built-in mechanisms for preventing unauthorized access and ensuring the integrity of the programmed logic.
  • High-Speed I/O: The device comes equipped with high-speed input/output pins that support a variety of signaling standards, enabling fast and flexible communication with other components in the system.
  • Package: The A3PE1500-FGG676I is available in a fine-pitch, 676-pin BGA (Ball Grid Array) package, which provides a compact footprint while allowing for efficient heat dissipation and reliable connections to the PCB (Printed Circuit Board).

Applications

The versatility of the A3PE1500-FGG676I makes it an excellent choice for a broad spectrum of applications, including:

  • Automotive systems
  • Industrial automation and control
  • Telecommunication infrastructure
  • Medical equipment
  • Defense and aerospace electronics

Microchip Technology's A3PE1500-FGG676I is engineered to provide designers with a flexible, secure, and low-power platform for creating sophisticated digital systems. Its robust feature set and adaptability make it a go-to solution for engineers looking to push the boundaries of what's possible with programmable logic devices.

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