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LFE3-150EA-7FN1156C

Part No LFE3-150EA-7FN1156C
Manufacturer Lattice Semiconductor Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 586 I/O 1156FBGA
Sample
Rohs State rohs
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 35 Weeks
Features series Field Programmable Gate Array (FPGA) IC 586 7014400 149000 1156-BBGA
Manufacturer Lattice Semiconductor Corporation
Series ECP3
Package Tray
Number of I/O 586
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 1156-BBGA
Case / Package 1156-FPBGA (35x35)
Family Name LFE3-150
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 24
Popularity High
Supply and Demand Status Balance
Win Source Part Number 922969-LFE3-150EA-7FN1156C
Ultra Librarian 3D Model Ultra Librarian LFE3-150EA-7FN1156C CAD Model

Description

The LFE3-150EA-7FN1156C is a Field-Programmable Gate Array (FPGA) from the Lattice ECP3 family. It's designed to offer a combination of high performance, low power consumption, and advanced features for a variety of applications. The device is packaged in a 1156-pin Fine-Pitch Ball Grid Array (FBGA) and has a speed grade of -7. The suffix 'C' signifies it is intended for commercial temperature range operation.

Applications

  • High-Performance Computing: Used as an accelerator for specific algorithms, offering speed and efficiency gains over CPUs or GPUs for specialized tasks.
  • Video and Image Processing: Used extensively in encoding/decoding, scaling, filtering, and other video processing functions for high-resolution video systems.
  • Data Center Networking: Employed in network interface cards (NICs) and switches to handle packet processing, security, and other networking functions.
  • Software-Defined Radio (SDR): Provides a flexible platform for implementing custom radio protocols and signal processing algorithms.
  • Industrial Control Systems: Offers the necessary processing power and I/O capabilities for complex control and automation tasks.

Features

  • 149K Logic Elements: Provides a large amount of programmable logic for implementing complex digital circuits.
  • High-Speed Transceivers: Features integrated high-speed transceivers for serial communication at rates up to several gigabits per second.
  • Embedded Memory: Includes on-chip RAM blocks for data storage and buffering, reducing reliance on external memory.
  • DSP Blocks: Contains dedicated Digital Signal Processing (DSP) blocks for accelerating arithmetic operations and signal processing algorithms.
  • Power Optimization: Designed for low power consumption, making it suitable for power-sensitive applications.
  • Flexible I/O: Supports a wide range of I/O standards, including DDR3, LVDS, and others, for interfacing with various external devices.

Benefits

  • Increased Design Flexibility: Enables designers to customize hardware to meet specific application requirements.
  • Accelerated Time-to-Market: Allows for rapid prototyping and development cycles.
  • Improved System Performance: Provides hardware acceleration for computationally intensive tasks.
  • Reduced System Costs: Integrates multiple functions into a single device, lowering BOM costs and board space.
  • Enhanced Security: Supports security features such as bitstream encryption to protect designs from unauthorized access.

Additional Details

The LFE3-150EA-7FN1156C is designed to operate within a commercial temperature range. It supports a wide array of configuration options and programming interfaces. The high-speed transceivers make it well-suited for communication-intensive applications. Refer to the Lattice Semiconductor datasheet for precise specifications on logic capacity, memory size, transceiver speeds, and supported I/O standards. The FBGA package is chosen for its good thermal properties and ease of integration into high-density printed circuit boards.

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