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for_Celeron_800

Part No for_Celeron_800
Manufacturer Intel
Catalog Embedded - Microprocessors
Description Cooling Fan for Celeron FC PGA
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ECAD Module
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Categories Embedded - Microprocessors
Win Source Part Number 955463-for_Celeron_800
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Ultra Librarian 3D Model Ultra Librarian for_Celeron_800 CAD Model

Description

The Intel Celeron 800 was a processor introduced in the early 2000s, targeting the value segment of the PC market. It provided a cost-effective solution for basic computing tasks. These processors were commonly used in budget desktops and laptops.

Applications

  • Basic desktop computing
  • Entry-level laptops
  • Point-of-sale (POS) systems
  • Thin client computers
  • Legacy industrial control systems

Features

  • 800 MHz Clock Speed: Operates at a clock frequency of 800 MHz.
  • FC-PGA/PGA370 Socket: Designed for use with FC-PGA or PGA370 socket motherboards.
  • 128 KB L2 Cache: Features a 128 KB Level 2 cache for improved performance.
  • 32-bit Architecture: Supports 32-bit computing.
  • Low Power Consumption: Designed for energy-efficient operation.

Benefits

  • Cost-effective: Provides a budget-friendly computing solution.
  • Adequate performance for basic tasks: Suitable for word processing, web browsing, and email.
  • Easy integration: Compatible with widely available motherboards and components.
  • Low power consumption: Reduces energy costs and heat generation.
  • Reliable operation: Offers stable and reliable performance for everyday use.

Additional Details

The Intel Celeron 800 was based on the Coppermine or Tualatin core, depending on the specific revision. It typically had a Front Side Bus (FSB) speed of 100 MHz. The processor was designed to compete with other budget processors in the market. The 128 KB L2 cache helped to improve performance compared to earlier Celeron processors with smaller cache sizes. The FC-PGA package was designed for easier heat sink attachment. While now obsolete, the Celeron 800 provided a viable option for basic computing needs at the time of its release. The thermal design power (TDP) was relatively low, making it suitable for systems with limited cooling capabilities.

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