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Categories Integrated Circuits (ICs)
Features series Field Programmable Gate Array (FPGA) IC 296 5760000 47500 484-BBGA, FCBGA
Manufacturer Intel
Series Stratix® III E
Package Tray
Part Status Obsolete
Number of I/O 296
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 484-BBGA, FCBGA
Case / Package 484-FBGA (23x23)
Family Name EP3SE50
MSL Level 3 (168 Hours)
ECCN 3A001A2C
HTSUS 8542.39.0001
Quantity per package 60
Popularity High
Supply and Demand Status Balance
Win Source Part Number 918302-EP3SE50F484I4N
Ultra Librarian 3D Model Ultra Librarian EP3SE50F484I4N CAD Model

Description

The Intel EP3SE50F484I4N is a high-performance FPGA (Field Programmable Gate Array) from the Stratix III family, designed to meet the demands of various high-bandwidth applications. It provides a flexible and efficient solution for custom logic implementation, signal processing, and embedded systems.

Applications

  • High-speed data processing
  • Telecommunications infrastructure
  • Video processing and encoding
  • Medical imaging equipment
  • Aerospace and defense systems
  • Industrial automation

Features

  • Logic Elements: 47,500 equivalent LEs, providing substantial capacity for complex digital designs.
  • Memory: Integrated memory blocks including M9K blocks for efficient data storage.
  • DSP Blocks: Dedicated DSP blocks for high-performance signal processing applications, enhancing computational capabilities.
  • I/O Pins: 484-pin FineLine BGA package with a high number of user I/Os for versatile interfacing.
  • Clock Management: Advanced clock management circuitry to support a variety of clocking schemes and frequencies.
  • Configuration: Supports various configuration modes including active serial, passive serial, and JTAG configuration.
  • Operating Temperature: Industrial temperature range (-40°C to 100°C), enabling usage in harsh environments.

Benefits

  • High Performance: Delivers high-speed performance for demanding applications.
  • Flexibility: Offers a flexible architecture for custom logic implementation.
  • Integration: Integrates memory and DSP blocks to optimize system performance and reduce component count.
  • Low Power: Optimized for low power consumption to minimize energy costs and improve system efficiency.
  • Reliability: High reliability and robustness, suitable for mission-critical applications.
  • Design Tools: Supported by Intel's Quartus Prime design software for easy design entry, simulation, and implementation.

Additional Details

The EP3SE50F484I4N is built on a 65nm technology node, providing a balance between performance, power, and cost. It supports a wide range of I/O standards and protocols, making it easy to interface with external devices. Its robust architecture and comprehensive feature set make it an ideal choice for a variety of high-performance applications.

This FPGA is designed to operate within an industrial temperature range, ensuring reliable operation in harsh environments. It is also supported by a comprehensive suite of design tools and documentation, making it easy to design, simulate, and implement complex digital systems.

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