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Same model may have multiple batches, images only for reference.
EP3C25F324I7 Real Image
Same model may have multiple batches, images only for reference.

EP3C25F324I7

Part No EP3C25F324I7
Manufacturer Intel
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 215 I/O 324FBGA
Datasheet
EP3C25F324I7 Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features series Field Programmable Gate Array (FPGA) IC 215 608256 24624 324-BGA
Manufacturer Intel
Series Cyclone® III
Package Tray
Number of I/O 215
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 324-BGA
Case / Package 324-FBGA (19x19)
Family Name EP3C25
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Part Number -EP3C25F324I7, 970554, EP3C25F324I7-ND, 544-3523
Quantity per package 84
Popularity High
Supply and Demand Status Balance
Win Source Part Number 918276-EP3C25F324I7
Ultra Librarian 3D Model Ultra Librarian EP3C25F324I7 CAD Model

Description

The Intel Cyclone III EP3C25F324I7 is a series Field Programmable Gate Array (FPGA) IC with a package of 324-BGA.

  • Series: Cyclone III
  • Package: 324-BGA
  • Temperature Range: -40°C to 100°C (TJ)
  • I/Os: 215
  • Family: EP3C25
  • Production Lead Time: 51 weeks
  • RoHS: RoHS compliant
  • REACH: REACH unaffected

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3+ $83.9236 $251.7708
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