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10M25DAF256C7G

Part No 10M25DAF256C7G
Manufacturer Intel
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 178 I/O 256FBGA / series Field Programmable Gate Array (FPGA) IC 178 691200 25000 256-LBGA
Sample
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ECAD Module
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Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr Intel
Series MAX® 10
Package Tray
Number of LABs/CLBs 1563
Number of Logic Elements/Cells 25000
Total RAM Bits 691200
Number of I/O 178
Voltage - Supply 1.15V ~ 1.25V
Mounting SMD (SMT)
Temperature Range - Operating 0°C ~ 85°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FBGA (17x17)
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Names 965261
Standard Package 90
Win Source Part Number 1194061-10M25DAF256C7G
Ultra Librarian 3D Model Ultra Librarian 10M25DAF256C7G CAD Model

Description

The 10M25DAF256C7G is an Intel MAX 10 FPGA, belonging to a family known for integrating flash memory, analog-to-digital converters (ADCs), and other essential features on a single chip. This model features approximately 25,000 logic elements (LEs), making it suitable for more complex designs compared to lower-density MAX 10 devices. The 'DAF256' designates the package type, and 'C7G' represents the temperature grade, speed grade and that the device is lead-free. It is designed to provide a cost-effective and power-efficient solution for a wide variety of embedded applications.

Applications

  • Industrial Automation
  • Motor Control
  • Sensor Interfaces
  • Embedded Vision Systems
  • Power Management
  • Automotive Electronics

Features

  • Integrated Flash Memory: On-chip storage for configuration data and user data, eliminating the need for external memory.
  • Analog-to-Digital Converters (ADCs): Enables direct interfacing with analog sensors and signals.
  • Nios II Embedded Processor Support: Facilitates the implementation of soft-core processors for embedded processing tasks.
  • Instant-on Capability: Rapid configuration time allows for immediate operation upon power-up.
  • Extensive I/O Options: Provides a wide variety of I/O interfaces for connecting with external devices and systems.
  • Advanced Security Features: Protects against unauthorized access and tampering.

Benefits

  • Reduced System Cost: Integration of multiple functions on a single chip lowers component count and board space.
  • Improved Power Efficiency: Low power consumption makes it suitable for battery-powered and energy-sensitive applications.
  • Faster Time-to-Market: Pre-designed IP blocks and development tools accelerate the design process.
  • Enhanced System Reliability: Integrated flash memory and security features improve system robustness.
  • Greater Design Flexibility: Programmable logic allows for customization and adaptation to specific application requirements.
  • Simplified System Design: Integrated ADCs and other features streamline system design and reduce complexity.

Additional Details

The 10M25DAF256C7G provides a versatile platform for implementing a wide range of embedded systems. The integrated flash memory simplifies configuration and allows for storing user data or firmware updates directly on the device. The ADCs enable direct interface with analog sensors, reducing the need for external analog-to-digital conversion circuitry. Intel provides a comprehensive suite of development tools and IP cores to support the design and implementation of applications using the MAX 10 FPGA family. This device is suitable for applications requiring a balance of logic density, power efficiency, and cost-effectiveness. The MAX 10 family is known for its robust architecture and high reliability, making it a popular choice for industrial and automotive applications.

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