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IDT7164L35TDB

Part No IDT7164L35TDB
Manufacturer IDT, Integrated Device Technology Inc
Catalog Memory
Description CMOS STATIC RAM 64K (8K x 8-BIT)
Sample
Rohs State rohs
ECAD Module
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Manufacturer IDT, Integrated Device Technology Inc
Win Source Part Number 1184476-IDT7164L35TDB
Manufacturer Homepage www.idt.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian IDT7164L35TDB CAD Model

Description

The IDT7164L35TDB is a high-speed, low-power 64K x 1 Static RAM (SRAM) manufactured by Integrated Device Technology (IDT). This SRAM device is designed for applications requiring fast access times and low power consumption, making it suitable for a variety of memory-intensive tasks.

Applications:

  • High-speed cache memory
  • Buffer memory
  • Control store memory
  • DSP (Digital Signal Processing) systems
  • Networking equipment

Features:

  • High-speed access time: 35ns
  • Low power consumption
  • Single 5V power supply
  • TTL compatible inputs and outputs
  • Fully static operation: No clock or refreshing required
  • Three-state outputs
  • Available in a ceramic DIP package

Benefits:

  • Enables high-performance system operation due to fast access times.
  • Reduces overall system power consumption, making it suitable for battery-powered or energy-efficient applications.
  • Simplifies system design with TTL compatible inputs and outputs.
  • Eliminates the need for complex timing and refresh circuitry due to fully static operation.
  • Facilitates easy memory expansion with three-state outputs.
  • Ensures reliable operation in various environments.

Additional Details:

The IDT7164L35TDB operates from a single 5V power supply and features TTL-compatible inputs and outputs, ensuring seamless integration with other digital components. Its fully static operation eliminates the need for external clocks or refresh cycles, simplifying the design and reducing system complexity. The three-state outputs allow for easy memory expansion and bus sharing. This SRAM is typically packaged in a ceramic DIP, which provides excellent thermal and electrical performance.

This device is specifically designed for applications that demand high speed and low power, offering a robust and reliable memory solution. It is well-suited for use in embedded systems, industrial controls, and other performance-critical applications where fast access times and low power consumption are essential.

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