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PEEL18CV8J-10

Part No PEEL18CV8J-10
Manufacturer ICT
Catalog HOT - SALES and EOL Components (N - P)
Sample
Rohs State Need to verify
ECAD Module
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Manufacturer ICT
Win Source Part Number 272592-PEEL18CV8J-10
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian PEEL18CV8J-10 CAD Model

Description

The PEEL18CV8J-10 is a Programmable Electrically Erasable Logic (PEEL) device manufactured by ICT. This device is designed to implement custom logic functions, replacing traditional TTL logic with a single programmable chip. The '18CV8' designates a specific architecture within the PEEL family, defining the number of inputs/outputs and the output macrocell type. The '-10' indicates a specific speed grade, in this case a propagation delay of 10ns.

Applications

  • Address Decoding: Used in memory systems to select specific memory locations quickly and efficiently.
  • High-Speed Peripheral Control: Facilitates fast communication between microprocessors and peripheral devices.
  • State Machines: Used for implementing control logic in high-speed digital systems.
  • Glue Logic: Provides a fast interface between digital components with different signal levels or timing requirements.
  • Timing Control: Generates precise timing signals for synchronous digital circuits.

Features

  • Electrically Erasable: Permits easy reprogramming and design modifications.
  • Programmable Logic: Offers a flexible architecture for implementing custom logic.
  • High-Speed Operation: Provides a fast propagation delay of 10ns for demanding applications.
  • TTL Compatible Inputs/Outputs: Allows for seamless integration with standard TTL devices.
  • Configurable Output Macrocells: Provides versatile output options for various application requirements.

Benefits

  • Reduced Board Space: Integrates multiple logic functions into a single device.
  • Simplified Design: Simplifies circuit design and reduces component count.
  • Improved Performance: Provides higher speed compared to slower PEEL devices.
  • Increased Reliability: Reduces the number of interconnections, enhancing system reliability.
  • Faster Time-to-Market: Allows for rapid prototyping and design iterations.

The PEEL18CV8J-10 is typically packaged in DIP (Dual In-line Package) or PLCC (Plastic Leaded Chip Carrier) for convenient PCB mounting. It is programmed using standard PROM programming equipment. The 'J' suffix may specify a particular temperature range or package variant. It is a suitable choice for applications that require fast logic implementation and programmability.

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