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HY5DU121622DFP-D43I-C

Part No HY5DU121622DFP-D43I-C
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR-400 32Mx16 FBGA
Sample
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Categories Memory
Win Source Part Number 944097-HY5DU121622DFP-D43I-C
Series *
Ultra Librarian 3D Model Ultra Librarian HY5DU121622DFP-D43I-C CAD Model

Description

The HY5DU121622DFP-D43I-C is a 256Mb DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) chip produced by Hynix Semiconductor. It is designed for high-speed data transfer in various applications.

Applications:

  • Graphics cards
  • Desktop and laptop computers
  • Gaming consoles
  • Networking equipment
  • Embedded systems requiring high-speed memory

Features:

  • Capacity: 256Mb (16M x 16 x 4 banks)
  • Data Rate: DDR (Double Data Rate)
  • Clock Frequency: The "-D43I" likely represents a specific speed grade, likely 200MHz (DDR400).
  • Voltage: Typically 2.5V
  • Interface: Standard DDR SDRAM interface
  • Operating Temperature: The "-I" suggests an industrial temperature range (-40C to +85C).
  • Package: FBGA (Fine-Pitch Ball Grid Array)

Benefits:

  • High Bandwidth: DDR technology provides increased data transfer rates.
  • Improved Performance: Enhances the performance of the host system.
  • Lower Power Consumption: 2.5V operation helps reduce power consumption.
  • Compact Size: FBGA packaging enables a smaller PCB footprint.
  • Industrial Temperature Range: The "-I" designation indicates suitability for harsh environments.

Additional Details:

The HY5DU121622DFP-D43I-C conforms to JEDEC standards for DDR SDRAM. The 16M x 16 x 4 banks organization defines the internal structure of the memory. The -D43I speed bin specifies the maximum operating frequency and corresponding timing characteristics. Refer to the Hynix datasheet for this specific part number for detailed timing specifications (CAS latency, RAS-to-CAS delay, etc.). The "-C" at the end might indicate a specific revision or manufacturing process. The industrial temperature range makes this memory suitable for applications that operate in extreme temperatures. The combination of high speed, low power, and industrial temperature operation makes it a versatile memory solution for a range of applications. The DDR interface simplifies integration into existing system designs.

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