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HY57V64420HGT-P

Part No HY57V64420HGT-P
Manufacturer Hynix Semiconductor
Catalog SD
Description SD 16Mx4-P PC100
Sample
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ECAD Module
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Categories Memory
Win Source Part Number 945359-HY57V64420HGT-P
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Ultra Librarian 3D Model Ultra Librarian HY57V64420HGT-P CAD Model

Description

The HY57V64420HGT-P is a 64Mbit SDRAM (Synchronous Dynamic Random-Access Memory) chip manufactured by Hynix Semiconductor. This memory chip is designed for high-speed data access and is suitable for a variety of applications requiring temporary data storage.

Applications:

  • Graphics Cards
  • Printers
  • Networking Equipment (Routers, Switches)
  • Set-Top Boxes
  • Embedded Systems

Features:

  • Capacity: 64Mbit (4M x 4 x 4 Banks)
  • Organization: 4M x 4 bits x 4 Banks
  • Interface: LVTTL Compatible
  • Clock Frequency: Up to 166MHz
  • Supply Voltage: 3.3V
  • Package Type: TSOP II
  • Refresh Modes: Auto Refresh and Self Refresh

Benefits:

  • High-Speed Data Transfer: Enables quick data access, enhancing system performance.
  • Large Storage Capacity: 64Mbit provides ample memory space for applications and data.
  • Low Power Consumption: Optimizes energy efficiency, extending battery life in portable devices.
  • Reliable Performance: Ensures stable and consistent operation in diverse environments.
  • Easy Integration: Standard interface and package facilitate seamless incorporation into existing systems.

Additional Details:

The HY57V64420HGT-P SDRAM is a synchronous dynamic random-access memory chip, which means its operations are synchronized with an external clock signal, enabling faster data transfer rates compared to asynchronous DRAM. The 4M x 4 x 4 Banks organization signifies that the memory is divided into four independent banks, allowing for concurrent access and improving overall memory throughput. The LVTTL compatible interface ensures easy interfacing with other digital components in the system. The auto refresh and self-refresh modes help maintain data integrity by periodically refreshing the memory cells. The TSOP II package offers a compact form factor for easy integration into various electronic devices. The 'HGT' likely refers to a specific speed grade or operating temperature range. Ensure that you consult the datasheet for specific timing parameters and operating conditions of the device. Suitable for applications needing moderate memory and speed capabilities. The presence of 4 banks allows for interleaved memory access which improves performance.

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