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H9AG9G5ANBX100

Part No H9AG9G5ANBX100
Manufacturer Hynix Semiconductor
Catalog DDR
Description eMCP 64GB eMMC5.1 + 32Gb(4GB) LPDDR4X-4266
Sample
Rohs State Need to verify
ECAD Module
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Categories Memory
Win Source Part Number 956860-H9AG9G5ANBX100
Series *
Ultra Librarian 3D Model Ultra Librarian H9AG9G5ANBX100 CAD Model

Description

The H9AG9G5ANBX100 is a 64GB eMMC5.1 and 32Gb (4GB) LPDDR4X-4266 eMCP package from Hynix Semiconductor. It is a high-performance, low-power memory solution for a wide range of mobile and embedded applications.

The eMMC5.1 interface provides faster data transfer speeds than previous generations of eMMC, up to 400MB/s read and 250MB/s write. The LPDDR4X-4266 interface provides even faster data transfer speeds, up to 4266MT/s.

The H9AG9G5ANBX100 is packaged in a 11.5mm x 13mm FBGA-254 package. It is RoHS compliant and operates over a wide temperature range, from -40°C to 85°C.

Features:

  • 64GB eMMC5.1 + 32Gb (4GB) LPDDR4X-4266
  • High performance: up to 400MB/s read and 250MB/s write for eMMC5.1, up to 4266MT/s for LPDDR4X-4266
  • Low power consumption
  • Small footprint: 11.5mm x 13mm FBGA-254 package
  • RoHS compliant
  • Wide temperature range: -40°C to 85°C

Applications:

  • Mobile devices: smartphones, tablets, wearables, etc.
  • Embedded systems: automotive infotainment, industrial automation, medical devices, etc.

Benefits:

  • Faster data transfer speeds: The H9AG9G5ANBX100 offers faster data transfer speeds than previous generations of eMMC and LPDDR4 memory, which can improve the performance of mobile and embedded devices.
  • Lower power consumption: The H9AG9G5ANBX100 is designed for low power consumption, which can extend the battery life of mobile devices and reduce the operating costs of embedded systems.
  • Smaller footprint: The H9AG9G5ANBX100 is packaged in a small FBGA-254 package, which can help to reduce the size and weight of mobile and embedded devices.
  • Wider temperature range: The H9AG9G5ANBX100 operates over a wide temperature range, from -40°C to 85°C, making it suitable for use in a variety of environments.

Overall, the H9AG9G5ANBX100 is a high-performance, low-power memory solution for a wide range of mobile and embedded applications. It offers faster data transfer speeds, lower power consumption, a smaller footprint, and a wider temperature range than previous generations of eMMC and LPDDR4 memory.

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Pricing & Ordering

Quantity Unit Price Ext. Price
2+ $28.9575 $57.9150
5+ $23.7600 $118.8000
7+ $23.0175 $161.1225
9+ $22.2750 $200.4750
12+ $21.5325 $258.3900
16+ $19.3050 $308.8800
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Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 26 pieces
MOQ: 2 pcs
Order Increment : 1 pcs
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