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H5TQ4G83CFR-RDJ

Part No H5TQ4G83CFR-RDJ
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1866 512Mx8 (4Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 940726-H5TQ4G83CFR-RDJ
Series *
Ultra Librarian 3D Model Ultra Librarian H5TQ4G83CFR-RDJ CAD Model

Description

The Hynix H5TQ4G83CFR-RDJ is a 4Gb DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip, manufactured by Hynix Semiconductor. This high-capacity memory component is designed for a broad range of applications requiring substantial memory and high-speed data transfer. Its features and architecture are optimized for both performance and power efficiency.

Applications

  • Desktop PCs
  • Laptop Computers
  • Graphics Cards
  • Gaming Consoles
  • Networking Devices (routers, switches)
  • Servers
  • Embedded Systems requiring significant memory

Features

  • Capacity: 4Gb (512M x 8)
  • Organization: Configured as 512M x 8 bits
  • Interface: DDR3, supporting high-speed data transmission
  • Data Rate: Up to 1600 Mbps (PC3-12800)
  • Voltage: Operates at 1.5V, designed for reduced power consumption
  • Operating Temperature: Standard commercial temperature range
  • Package: FBGA (Fine-pitch Ball Grid Array) for optimized board space and thermal dissipation

Benefits

  • Large Memory Capacity: 4Gb capacity supports demanding applications and large datasets.
  • High Bandwidth: DDR3 interface enables fast data transfer, enhancing system responsiveness.
  • Low Power Consumption: 1.5V operation extends battery life in portable devices and reduces overall system power.
  • Improved System Performance: Faster memory access times contribute to quicker application loading and smoother multitasking.
  • Reliable Operation: Manufactured by Hynix, ensuring high quality and dependable performance.

Additional Details

The H5TQ4G83CFR-RDJ DDR3 SDRAM is compliant with JEDEC standards for DDR3 memory. It features power-saving modes to minimize energy usage during idle states. Key architectural features include write leveling, dynamic on-die termination (ODT), and auto-refresh, improving signal integrity and system stability. The FBGA package facilitates efficient heat dissipation, allowing for reliable operation even under heavy workloads. This chip is ideal for use in a variety of consumer, industrial, and server applications where a large memory footprint, high performance, and power efficiency are critical. Its widespread adoption in numerous electronic devices highlights its versatility and reliability in meeting the demands of modern computing.

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