The H5TQ1G83TFR-G7C-C is a DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip manufactured by Hynix Semiconductor. It is a 1Gb (Gigabit) memory component, organized as 128M x 8, designed for applications requiring fast data access and efficient power management.

Applications

• Desktop and Laptop Computers
• Graphics Cards
• Embedded Systems
• Networking Devices
• Gaming Consoles

Features

• Capacity: 1Gb (128M x 8)
• Interface: DDR3 SDRAM
• Operating Voltage: 1.5V (Typical)
• Speed Grade: G7C (Determines the maximum clock frequency and data transfer rate)
• Data Rate: Supports data transfer rates up to DDR3-1600 (PC3-12800), depending on the specific G7C speed bin.
• Clock Frequency: Operates at a clock frequency determined by the speed grade.
• Package: FBGA (Fine-Pitch Ball Grid Array)
• RoHS Compliant: Lead-free and compliant with RoHS environmental standards.
• Power Saving Features: Deep Power-Down mode to reduce power consumption when inactive.
• Double Data Rate: Transfers data on both the rising and falling edges of the clock signal.

Benefits

• High Bandwidth: Provides significantly higher bandwidth than previous generations of DDR memory.
• Low Power Consumption: Operates at 1.5V, reducing power consumption.
• Improved Performance: Enhances overall system performance, especially in memory-intensive applications.
• Cost-Effective: Offers a good balance of performance and cost.
• Wide Availability: DDR3 memory is widely available and supported.
• Reliable Operation: Designed for high reliability and stability.

Additional Details

The G7C speed grade defines the maximum supported clock frequency and data transfer rate. Consult the Hynix datasheet for the precise specifications. The FBGA package provides a compact footprint and efficient thermal dissipation. DDR3 SDRAM utilizes a prefetch architecture for improved data throughput. The organization of 128M x 8 means that the memory is organized into 128 million locations, each storing 8 bits of data.