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H5TC4G83DFR-PBC

Part No H5TC4G83DFR-PBC
Manufacturer Hynix Semiconductor
Catalog DDR
Description Incorrect partno DDR3-1600 512Mx8 (4Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 940660-H5TC4G83DFR-PBC
Series *
Ultra Librarian 3D Model Ultra Librarian H5TC4G83DFR-PBC CAD Model

Description

The Hynix H5TC4G83DFR-PBC is a DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) component designed for applications requiring high memory bandwidth and efficient data processing. This memory chip is commonly used in a variety of devices, from desktop and laptop computers to embedded systems and networking equipment, where performance and reliability are paramount.

Applications:

  • Desktop and laptop computers
  • Gaming consoles
  • Networking devices such as routers and switches
  • Embedded systems in industrial and automotive applications
  • Digital video recorders (DVRs) and surveillance systems

Features:

  • DDR3 SDRAM Technology: Offers improved performance and lower power consumption compared to DDR2 SDRAM.
  • High Bandwidth: Enables rapid data transfer for demanding applications.
  • Low Voltage Operation: Reduces power consumption and heat generation, enhancing energy efficiency.
  • 8-bit pre-fetch architecture: Improves memory access efficiency.
  • On-Die Termination (ODT): Helps maintain signal integrity at high speeds.

Benefits:

  • Increased System Performance: Enhances overall system speed and responsiveness.
  • Reduced Power Consumption: Contributes to longer battery life in portable devices and lower energy costs.
  • Enhanced Reliability: Designed for stable and consistent performance under various operating conditions.
  • Greater Memory Capacity: Provides ample memory space for demanding applications.
  • Improved Gaming Experience: Facilitates smoother and more responsive gameplay.

Additional Details:

The H5TC4G83DFR-PBC's performance is primarily determined by its clock frequency, timing parameters, and operating voltage. It is essential for system designers and hardware engineers to consult the official datasheet to obtain precise technical specifications, including timing diagrams, voltage levels, and operating temperature ranges. Proper implementation and adherence to these specifications are crucial for maximizing the memory chip's potential and ensuring its reliable operation within the target system. Furthermore, understanding the thermal characteristics of the device is important for effective heat management and preventing overheating, which can impact performance and longevity.

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