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H5TC2G63GFR-RDC

Part No H5TC2G63GFR-RDC
Manufacturer Hynix Semiconductor
Catalog DDR
Description Incorrect partno DDR3-1866 128Mx16 (2Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941097-H5TC2G63GFR-RDC
Series *
Ultra Librarian 3D Model Ultra Librarian H5TC2G63GFR-RDC CAD Model

Description

The H5TC2G63GFR-RDC is a 2Gb DDR3 SDRAM (Double Data Rate Three Synchronous Dynamic Random-Access Memory) component manufactured by Hynix Semiconductor. This memory chip is designed for high-performance applications that demand significant memory bandwidth and capacity. DDR3 technology provides faster data transfer rates and lower power consumption compared to previous DDR generations.

Applications

  • Desktop PCs
  • Laptop computers
  • Graphics cards
  • Gaming consoles
  • Networking devices

Features

  • Capacity: 2Gb (256M x 8)
  • DDR3: Double Data Rate Three architecture for increased bandwidth and performance
  • Data Transfer Rate: Up to 1600 MHz (This can vary based on the specific speed grade)
  • Clock Frequency: Operates with a clock frequency, generally around 800MHz for common DDR3 speeds.
  • Interface: Standard DDR3 interface
  • Power Supply: Typically operates at 1.5V
  • Package: FBGA (Fine-Pitch Ball Grid Array) package for efficient board-level assembly
  • RoHS Compliant: Lead-free and compliant with RoHS environmental standards

Benefits

  • High Bandwidth: DDR3 technology significantly increases memory bandwidth, improving data processing and system performance.
  • Increased Memory Capacity: 2Gb capacity allows for storing and processing large amounts of data, making it suitable for demanding applications.
  • Low Power Consumption: Designed for lower power consumption, improving energy efficiency.
  • Easy Integration: Standard DDR3 interface simplifies integration into existing systems and designs.
  • Reliability: Hynix is a reputable memory manufacturer known for producing reliable and high-quality memory components.

Additional Details

The H5TC2G63GFR-RDC is well-suited for applications where memory bandwidth is critical for performance. Its DDR3 architecture and specifications contribute to fast and efficient data processing. The FBGA package enables efficient heat dissipation and allows for high-density board designs. For optimal performance, it's essential to understand the timing parameters, such as CAS latency (CL). The -RDC suffix likely indicates a specific speed grade or operating temperature range. Always refer to the Hynix datasheet for detailed specifications, timing diagrams, and application notes to ensure proper implementation and maximize performance. Pay attention to termination requirements and proper layout techniques to maintain signal integrity.

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