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H5TC2G63BFR-H9C

Part No H5TC2G63BFR-H9C
Manufacturer Hynix Semiconductor
Catalog DDR
Description Incorrect partno DDR3-1333 128Mx16 (2Gb) 1.35V
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941086-H5TC2G63BFR-H9C
Series *
Ultra Librarian 3D Model Ultra Librarian H5TC2G63BFR-H9C CAD Model

Description

The Hynix H5TC2G63BFR-H9C is a high-performance DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) component. It is designed for use in various applications requiring high bandwidth and low latency data access, such as desktop PCs, laptops, servers, and embedded systems.

Applications:

  • Desktop PCs: Main memory module for desktop computers.
  • Laptops: Memory for portable computing devices.
  • Servers: RAM for server systems, providing high-speed data access.
  • Embedded Systems: Used in embedded applications requiring significant memory capacity and speed.

Features:

  • Capacity: 2Gb (Gigabit) DDR3 SDRAM.
  • Organization: Configured as 128M x 16.
  • Data Transfer Rate: Operates at high data transfer rates, enhancing system performance.
  • Interface: Standard DDR3 interface, ensuring compatibility with a wide range of chipsets and systems.
  • Operating Voltage: Typically operates at 1.5V, offering a balance between performance and power consumption.
  • Clock Frequency: Supports various clock frequencies, allowing for flexible system configuration.
  • Package: FBGA (Fine-Pitch Ball Grid Array) package for efficient board mounting and thermal performance.
  • Lead-Free: Compliant with RoHS (Restriction of Hazardous Substances) standards.

Benefits:

  • Increased System Performance: High data transfer rates improve overall system responsiveness and performance.
  • Power Efficiency: Low operating voltage contributes to reduced power consumption and heat generation.
  • Large Memory Capacity: 2Gb capacity allows for handling large datasets and complex applications.
  • Reliability: Hynix Semiconductor is known for producing reliable and durable memory components.
  • Compatibility: DDR3 interface ensures broad compatibility with existing systems and chipsets.

Additional Details:

The H5TC2G63BFR-H9C adheres to JEDEC (Joint Electron Device Engineering Council) standards for DDR3 SDRAM, ensuring interoperability and compliance. It supports various DDR3 features such as prefetch, burst modes, and on-die termination (ODT). This memory chip is crucial for applications where fast and reliable memory access is essential, contributing to the overall efficiency and responsiveness of the computing system. Its advanced features and optimized design make it a suitable choice for demanding applications in desktop, laptop, server, and embedded environments.

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