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H5PS5162KFR-Y5J

Part No H5PS5162KFR-Y5J
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR2-667 32Mx16
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941767-H5PS5162KFR-Y5J
Series *
Ultra Librarian 3D Model Ultra Librarian H5PS5162KFR-Y5J CAD Model

Description

The Hynix H5PS5162KFR-Y5J is a 512Mb DDR2 SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) chip. It's designed for applications requiring a balance of moderate memory capacity and efficient performance, such as embedded systems, networking devices, and consumer electronics. This component offers a good compromise between speed, capacity, and power consumption, making it versatile for a range of applications.

Applications:

  • Embedded Systems
  • Networking Devices
  • Consumer Electronics
  • Set-Top Boxes
  • Low-End Graphics Solutions

Features:

  • Capacity: 512Mb (64M x 8)
  • Interface: DDR2 SDRAM
  • Clock Frequency: Specified by the speed grade (Y5J) - typically up to 533 MHz (1066 MHz effective)
  • Voltage: 1.8V
  • Data Rate: Up to 1066 Mbps
  • Operating Temperature Range: Commercial
  • Package: FBGA (Fine-pitch Ball Grid Array)
  • Double data rate architecture: Enables high-speed data transfer.
  • On-chip DLL (Delay-Locked Loop): Provides precise data timing control.
  • Write latency = Read latency - 1 clock cycle
  • Burst Length: 4 or 8

Benefits:

  • Enhanced Performance: DDR2 interface delivers improved data transfer rates.
  • Efficient Memory Access: Improves overall system responsiveness.
  • Low Power Consumption: Operates at 1.8V, reducing energy usage.
  • Reliable Operation: Ensures stable performance across diverse applications.
  • Compact Design: FBGA package allows for dense PCB layouts.

Additional Details:

The H5PS5162KFR-Y5J utilizes DDR2 architecture to achieve high bandwidth by transferring data on both the rising and falling edges of the clock signal. The on-chip DLL ensures accurate data timing, which minimizes skew and improves overall performance. Packaged in a FBGA, this component provides excellent thermal characteristics and supports high-density PCB designs. It is an excellent solution for applications that require a balance of speed, capacity, and power efficiency.

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Pricing & Ordering

Quantity Unit Price Ext. Price
12+ $4.8972 $58.7664
29+ $4.0182 $116.5278
45+ $3.8924 $175.1580
62+ $3.7665 $233.5230
80+ $3.6417 $291.3360
107+ $3.2652 $349.3764
!
Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 879 pieces
MOQ: 12 pcs
Order Increment : 1 pcs
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